A Practical Approach To Electromagnetic Compatibility

Pages : 404

Price : Rs 900/-

Edition: 2024.

Publisher : EMC Publications, Pune

Author : Chetan Kathalay -A distinguished Scientist and Director (Retd.) ETDC, Govt. of India, STQC Directorate, Pune.

Click here to know more about the author

Click here to view sample  

Click here to buy a copy

This book is intended for readers who are interested in the practical aspects of EMC testing and compliance rather than complicated mathematical theory and derivations. It has been written in such a way that the reader will be able to pick up the concepts and incorporate them right away in the design without worrying too much about theory. For the Indian manufacturer, it will not only save money involved in buying costly books by foreign authors but also spare them of incessant surfing on the internet (which only results in conflicting and confusing ideas). 

The book is conveniently divided into two parts.

Part I of the book deals with fundamentals, standards and test methodologies. This part helps the reader to develop a thorough understanding of the EMI phenomenon, contents of EMC standards and details of EMC testing. It has six chapters namely EMC fundamentals, EMC Standards, Conducted Emission measurement, Radiated Emission measurement, Conducted Immunity testing and Radiated Immunity testing.

Part II of the book has five chapters on EMC design namely Line Filtering, Shielding, PCB design, Grounding & Bonding and Cable Selection & Routing. These chapters will enable the reader to thoroughly understand all EMC design methodologies and encourage him/her to incorporate EMI suppression measures in the design stage of itself. This will avoid costly retrofits at the eleventh hour which not only add to equipment cost but also lead to loss of precious time.

And last but not the least, the book ends with an introduction to CE marking - a mandatory compliance mark placed on products intended for export to the European Union.  

CONTENTS 

PART I

CHAPTER 1 : INTRODUCTION TO EMI/EMC.

1.1 WHAT IS EMI/RFI?

1.2 HISTORY OF EMI

1.3 THE PROBLEM OF EMI

1.4  EFFECTS OF EMI

1.5 NEED FOR EMC

1.6 REALISATION OF EMC

1.7 EMC TESTS AND MEASUREMENT

1.8 ELEMENTS OF EMI

1.9 COUPLING MECHANISMS

1.10 EMI VICTIMS

1.11. CONCLUSION

CHAPTER 2. EMC STANDARDS

2.1 INTRODUCTION
2.2 CONTENTS OF EMC STANDARDS
2.3 TYPES OF EMC STANDARDS

2.4 CIVILIAN EMC STANDARDS

2.4.1 International Electrotechnical Commission (IEC) (Www.IEC.Ch)

2.4.2 IEC EMC Standards

2.4.3 Type Of IEC Standards

2.4.3.2 Product Standards :

2.4.3.3 Generic Standards :.

2.4.4  Basic Standards And Tc-77

2.4.5 Overview Of IEC Basic Standards

2.4.6 IEC 61000-3- Series

2.4.7  IEC 61000-4 Series Of Basic Standards

2.4.8 IEC Generic Standards

2.4.9 CISPR Standards

2.4.12 Frequently Referred CISPR Standards

2.4.13 IEC Automotive Standards

2.4.14 Automotive Emission Standards

2.4.15 Automotive Susceptibility/Immunity Standards

2.4.16  Indian Standards (Is)

2.4.17  European Standards

2.4.18 Cenelec Historical Background

2.4.19 Cenelec Structure

2.4.20 Membership

2.4.21 Other European Standards Organizations

2.4.22 The Making Of An En Standard

2.4.23 European EMC Standards

2.4.24 Federal Communcations Commission (FCC) Standards

2.4.25 FCC Part 15 : Radio Devices

2.4.26 FCC Part 18—Industrial, Scientific, And Medical Equipment

2.4.27 FCC Procedures For Showing Conformance

2.5 MILITARY EMC STANDARDS

2.6 INTRODUCTION TO EMC TESTING

CHAPTER 3 CONDUCTED EMISSION (CE) MEASUREMENT

3.1 INTRODUCTION

3.2 TEST SETUP

3.3 MEASUREMENT INSTRUMENTATION

3.4 EMI RECEIVER

3.5. RECEIVER STAGES IN DETAIL

                     3.5.1 I/P  Attenuator

3.5.2 Pre-selector and RF amplifier

3.5.3 Mixer

3.5.4 IF Amplifier

3.5.5 Detectors

3.5.6. Peak Detector

3.5.7. Quasi-peak (QP) detector

3.5.8. Average  Detector

3.5.9. RMS detector

3.5.10. RMS-average detector

3.5.11 EMI Receiver Vs Spectrum Analyzer.

3.6 UNITS OF MEASUREMENT.

3.7 CONDUCTED EMISSION LIMITS

3.8 LABORATORY TEST SETUP

3.9. EUT CONFIGURATION

3.10. MEASUREMENT PROCEDURE

3.11.  DISCONTINUOUS EMISSION OR CLICKS.

3.12 MEASUREMENT OF CLICKS.

3.13 LOW FREQUENCY CONDUCTED EMISSION: HARMONICS

3.14. LOW FREQUENCY CONDUCTED EMISSION: FLICKER

3.15 TEST REPORTS

3.16 REFERENCES

CHAPTER 4 RADIATED EMISSION (RE) MEASUREMENT
4.1 INTRODUCTION

4.2 BASIC TEST SETUP
4.3 MEASUREMENT INSTRUMENTATION
    4.3.1 EMI Receiver
    4.3.2. Antennas            
 4.3.3. Antenna Factor (AF)
4.4 UNITS OF MEASUREMENT
4.5 FREQUENCY RANGE OF MEASUREMENT
4.6 LIMITS4.7 MEASUREMENT SITE
    4.7.1. Open Area Test Site (OATS

    4.7.5 Anechoic Chambers
    4.7.6 Transverse Electro-Magnetic (TEM) CELLs
4.8. RADIATED EMISSION MEASUREMENT PROCEDURE
4.9 DISTURBANCE POWER MEASUREMENT
4.10 NEAR FIELD EMISSION MEASUREMENT
4.11 TEST REPORTS
4.12 CONCLUSION
CHAPTER 5. CONDUCTED IMMUNITY/SUSCEPTIBILITY TESTING

5.1  INTRODUCTION

5.2  GENERAL TEST SETUP

5.3  ELECTRICAL  FAST  TRANSIENTS / BURST (EFT/B)

5.4 SURGE TESTING

5.5. CONDUCTED  SUSCEPTIBILITY --CONTINUOUS WAVE.             
5.6 ELECTROSTATIC DISCHARGE TEST

5.7. EVALUATION OF TEST RESULTS

5.8. TEST REPORT

5.9. CONCLUSION

PART II

CHAPTER 6 : RADIATED SUSCEPTIBILITY/IMMUNITY TESTING

6.1 INTRODUCTION

6.2. GENERAL TEST SET-UP.

6.3. SHILEDED ENCLOSURES

6.4. ANTENNAS

6.5. SIGNAL GENERATORS AND AMPLIFIERS

6.6. MEASURING EQUIPMENT

6.7. ANCILLARY EQUIPMENT

6.8. SEVERITY LEVELS AND FREQUENCY RANGES

6.9. FIELD CALIBRATION.

6.10. TEST PROCEDURE

6.11. ALTERNATE TEST METHOD

6.12. TESTING IN A GTEM CELL
6.13 EVALUATION OF TEST RESULTS AND TEST REPORTS

CHAPTER 7. FILTERING

7.1. INTRODUCTION

7.2. FILTER TYPES

7.3. FILTER IMPEDANCE

7.4. POWER LINE FILTERS

7.5. BASIC ELEMENTS OF FILTERS

7.5.1. Common Mode Choke

7.5.5. X Capacitors

7.5.8. Y  Capacitors

7.6 POWER LINE FILTER DESIGN
7.6.2 Filter design approach-1.

7.6.3. Filter design approach-2

7.6.3.2. Values of common mode components.

7.6.3.3. Determining differential mode (DM) attenuation.

7.6.3.4. Values of differential mode components.

7.7. OTHER FILTER COMPONENTS

7.7.1. Metal Oxide Varistors  
7.7.2. Gas Discharge Tubes (GDT)

7.7.2.1. Working

7.7.3. Transient Voltage Supressors (TVS) / Silicon Avalanche Suppressors (SAS).

7.7.4. Hybrid transient suppressors

7.8. TRANSIENT SUPPRESSIONS IN RELAYS AND MOTORS
7.9. MULTISTAGE POWER LINE FILTERS

7.10. FERRITEs

7.11. FILTERS FOR DC LINES
7.12. FILTERS FOR DATA CABLES7.13. FILTERED PIN CONNECTORS
7.14. FILTER INSTALLATION7.15 FILTER PERFORMANCE EVALUATION
7.16 CONCLUSION.

CHAPTER 8. SHIELDING

8.1. INTRODUCTION

8.2. MECHANISM OF RADIATION

8.3. SHIELDING MECHANISMS

8.4 CHOICE OF SHIELD MATERIAL

8.6. PENETRATIONS AND APERTURES

8.6.5 Ventilation Louvers And Holes

8.6.7. Keypad And Displays

8.7 LEAKAGES AT SEAMS

8.7.1.EMC gaskets.

8.7.7. Metallic Finger-Stock

8.7.10Shielding For Connector Openings

8.7.11Shielding Of Plastic Enclosures

8.8. SHIELDS FOR CABLES

8.9. CONCLUSION.

CHAPTER  9. PCB DESIGN FOR EMC

9.1 NEED FOR EMC DESIGN AT PCB LEVEL.

9.2 PRINTED CIRCUIT BOARD (PCB)

9.3 BOARD ZONING

9.4 ASPECTS OF A GOOD PCB DESIGN

9.5 COMMON IMPEDANCE COUPLING IN PCBs

9.6. GENERAL CONSIDERATIONS FOR A PCB

9.6.1.Supply entry

9.6.2 Entry of digital and analog inputs

9.6.3. Bypass capacitors

9.6.4. Supply distribution

9.6.5. Decoupling and bulk decoupling capacitors

9.6.6. Connecting load capacitors of crystal to microcontroller ground.

9.7. MULTILAYER BOARD AND HIGH SPEED PCB DESIGN

9.8 MULTILAYER CONCEPTS

9.8.1. Board Stack-up

9.8.2. Power and ground planes

9.8.4. Reducing cross-talk –The 3W Rule

9.8.5. Guard traces

9.9. POWER AND GROUND PLANES

9.10. PLANE RESONANCE

9.11. RESONANCE BETWEEN PLANE PAIRS

9.13. HOLES AND DISCONTINUITIES IN GROUND PLANE.

9.14 ANTIPAD DESIGN

9.15 ROUTING TRACES NEAR ANTIPADS AND SLOTS
9.16. PROBLEMS WITH SPLIT PLANE

9.17. WHEN TRACE CHANGES LAYERS

9.18. CONNECTING DEVICES TO PLANES

9.19. DECOUPLING CAPACITOR PLACEMENT

9.20. USING MULTIPLE DECAPS IN PARALLEL

9.21. DEVICE PLACEMENT

9.22. BOARD STACKING

9.22.3. Board stacking of eight layer PCB

9.22.2 Board stacking of six layer PCB

9.23. MICROVIA / HDI TECHNOLOGy

9.24. SEGREGATION

9.24.1. Segregation  using filters

9.24.1.1. SMD filter components

9.24.1.2. RF reference

9.24.1.3. Filter for data lines

9.24.1.4. Filter for unshielded off board connector

9.24.2 Segregation using board level shielding

9.24.2.1 Interconnections to components inside a shielding can

CHAPTER 10. GROUNDING AND BONDING
10.1. INTRODUCTION

10.2. PURPOSE OF GROUNDING

10.3. STANDARDS REGARDING SAFETY GROUND

10.4. EQUIPMENT AND SYSTEM GROUNDING

10.5. TYPES OF GROUNDING

10.6. REDUCING COMMON GROUND IMPEDANCE COUPLING

10.7. GROUNDING OF CABLE SHIELDS

10.8. GROUNDING OF FARADAY SHIELDED TRANSFORMER

10.9. EARTH PITS

10.10 ELECTRICAL BONDING

10.10.1. Effects of improper bonding

10.10.2. Behaviour of a bond at radio frequencies

10.10.3. Types of bonding

10.10.4. Surface treatment

10.10.5. Mitigation of corrosion.      

10.10.6. Bonding practices

10.10.7. Bonding of protective earth wire

10.10.8. Bonding of internal protective earth wires

10.10.9. Bonding of mounting plate to the chassis/ electronic cabinet

10.10.10 Bonding screened cables with connectors

10.10.11. Bonding screened cables that have no connectors

10.10.12. Bonding of connector panels

10.10.13. bonding of connectors on connector panel

10.10.14 Bonding of metal cableways.

CHAPTER 11 CABLE SELECTION AND ROUTING

11.1 Introduction

11.2. Cable Coupling Mechanisms

11.3. Running Cables In An Installation

11.4.Shape Of Cable Ways

11.5. Cable Classes

11.6. Type Of Cables For A Particular Class

11.7. Cable Segregation

11.8. Reducing Common Mode Coupling

11.9. Reducing Differential Mode Coupling

11.10. Cable Routing In An Electronics Control Panel

CHAPTER 12. CE MARKING
12.1. Introduction
12.2. The European Union Background
12.3. Eu Institutional Structure
12.4. Type Of Legislative Actions
12.5. Ce Marking And Other Marks
12.6. Essential Requirements Of Ce Marking
12.7. The New Approach To Conformity
12.8. Eu Directives12.9. Harmonized European Standards
12.10. The Global Approach To Conformity
12.11. Notified Bodies
12.12. The Ce Marking Procedure